Recent Advance on Semiconductor Packaging.- System-in-Package.- Fan-In Wafer/Panel-Level Chip-Scale Packages.- Fan-Out Wafer/Panel-Level Packaging.- 2D, 2.1D, and 2.3D IC Integration.- 2.5D IC Integration.- 3D IC Integration.- Hybrid Bonding.- Chiplets Packaging.- Dielectric Materials.- Trends and Roadmap for Advanced Semiconductor Packaging.

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